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DATA SHEET
PHOTOCOUPLER
PS2711-1
HIGH CTR 4-PIN SOP PHOTOCOUPLER
-NEPOC
TM
Series-
DESCRIPTION
The PS2711-1 is an optically coupled isolator containing a GaAs light emitting diode and an NPN silicon phototransistor in a plastic SOP for high density applications. The package is an SOP (Small Outline Package) type for high density mounting applications.
FEATURES
* High current transfer ratio (CTR = 200 % TYP. @ IF = 1mA) * High isolation voltage (BV = 3 750 Vr.m.s.) * Small and thin package (4-pin SOP) * Ordering number of tape product: PS2711-1-F3, F4 * UL approved: File No. E72422 (S)
APPLICATIONS
* Programmable logic controllers * Small power supply * Hybrid IC * Modem/FAX
The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for availability and additional information.
Document No. P14945EJ1V0DS00 (1st edition) Date Published July 2000 NS CP(K) Printed in Japan
(c)
2000
PS2711-1
PACKAGE DIMENSIONS
in millimeters
40.5
TOP VIEW
4 3 1. Anode 2. Cathode 3. Emitter 4. Collector
1
2
7.00.3 4.4
2.10.2
0.10.1
2.54 0.4
+0.10 -0.05
0.15 +0.10 -0.05
0.50.3 0.25 M
MARKING
No. 1 pin Mark
2711 N003
Trade Mark Type Number Assembly Lot
N 0 03 Week Assembled Year Assembled (Last 1 Digit) CTR Rank Name
2
Data Sheet P14945EJ1V0DS00
PS2711-1
ORDERING INFORMATION
Part Number PS2711-1 PS2711-1-F3 PS2711-1-F4 Package 4-pin SOP Packing Style 50 pcs (Tape 50 pcs cut) Embossed Tape 3 500 pcs/reel Safety Standards Approval UL approved Application Part *1 Number PS2711-1
*1 For the application of the Safety Standard, following part number should be used.
ABSOLUTE MAXIMUM RATINGS (TA = 25 C, unless otherwise specified)
Parameter Diode Forward Current (DC) Reverse Voltage Power Dissipation Derating Power Dissipation Peak Forward Current Transistor
*1
Symbol IF VR
Ratings 50 6 0.8 80 0.5 40 5 40 1.5 150 3 750 -55 to +100 -55 to +150
Unit mA V mW/C mW A V V mA mW/C mW Vr.m.s. C C
PD/C
PD IFP VCEO VECO IC
Collector to Emitter Voltage Emitter to Collector Voltage Collector Current Power Dissipation Derating Power Dissipation
PC/C
PC BV TA Tstg
Isolation Voltage
*2
Operating Ambient Temperature Storage Temperature
*1 PW = 100 s, Duty Cycle = 1 % *2 AC voltage for 1 minute at TA = 25 C, RH = 60 % between input and output
Data Sheet P14945EJ1V0DS00
3
PS2711-1
ELECTRICAL CHARACTERISTICS (TA = 25 C)
Parameter Diode Forward Voltage Reverse Current Terminal Capacitance Transistor Collector to Emitter Dark Current Current Transfer Ratio *1 (IC/IF) Collector Saturation Voltage Isolation Resistance Isolation Capacitance Rise Time Fall Time
*2
Symbol VF IR Ct ICEO IF = 5 mA VR = 5 V
Conditions
MIN.
TYP. 1.15
MAX. 1.4 5
Unit V
A
pF
V = 0 V, f = 1 MHz IF = 0 mA, VCE = 40 V
30 100
nA
Coupled
CTR
IF = 1 mA, VCE = 5 V
100
200
400
%
VCE (sat) RI-O CI-O tr tf
IF = 1 mA, IC = 0.2 mA VI-O = 1 kVDC V = 0 V, f = 1 MHz VCC = 5 V, IC = 2 mA, RL = 100 10
11
0.3
V
0.4 4 5
pF
s
*2
*1 CTR rank N : 100 to 400 (%) K : 200 to 400 (%) L : 150 to 300 (%) M : 100 to 200 (%) *2 Test circuit for switching time
Pulse Input PW = 100 s Duty cycle = 1/10 IF In monitor 50 RL = 100 VOUT VCC
4
Data Sheet P14945EJ1V0DS00
PS2711-1
TYPICAL CHARACTERISTICS (TA = 25 C, unless otherwise specified)
DIODE POWER DISSIPATION vs. AMBIENT TEMPERATURE
Transistor Power Dissipation PC (mW)
TRANSISTOR POWER DISSIPATION vs. AMBIENT TEMPERATURE
200
100
Diode Power Dissipation PD (mW)
80
150
60
100
40
20
50
0
25
50
75
100
0
25
50
75
100
Ambient Temperature TA (C)
Ambient Temperature TA (C)
FORWARD CURRENT vs. FORWARD VOLTAGE
100
Collector to Emitter Dark Current ICEO (nA)
COLLECTOR TO EMITTER DARK CURRENT vs. AMBIENT TEMPERATURE
10 000
Forward Current IF (mA)
10
1 000 VCE = 40 V 20 V 10 V
TA = +100 C +60 C +25 C
1 0 C -25 C -50 C
100
0.1
10
0.01 0.0
0.5
1.0
1.5
2.0
1 -25
0
25
50
75
100
Forward Voltage VF (V)
Ambient Temperature TA (C)
COLLECTOR CURRENT vs. COLLECTOR TO EMITTER VOLTAGE
25 IF = 10 mA
Collector Current IC (mA) Collector Current IC (mA)
COLLECTOR CURRENT vs. COLLECTOR SATURATION VOLTAGE
100 10 mA 5 mA 2 mA 10 1 mA 1 IF = 0.5mA
20 5 mA 15
10 2 mA 5 1 mA 0.5 mA 0 2 4 6 8 10
0.1 0.0
0.2
0.4
0.6
0.8
1.0
Collector to Emitter Voltage VCE (V)
Collector Saturation Voltage VCE(sat) (V)
Data Sheet P14945EJ1V0DS00
5

NORMALIZED CURRENT TRANSFER RATIO vs. AMBIENT TEMPERATURE
Normalized Current Transfer Ratio CTR
1.6 500 1.4 1.2
PS2711-1
CURRENT TRANSFER RATIO vs. FORWARD CURRENT
Current Transfer Ratio CTR (%)
VCE = 5 V, n=3
400
1.0
300
0.8
0.6
200
0.4
0.2
Normalized to 1.0 at TA = 25 C, IF = 1 mA, VCE = 5 V 50 75
100
0.0 -50
-25
0
25
100
0 0.01
0.1
1
10
100
Ambient Temperature TA (C)
Forward Current IF (mA)
SWITCHING TIME vs. LOAD RESISTANCE
SWITCHING TIME vs. LOAD RESISTANCE
IF = 1 mA, VCC = 5 V, CTR = 200 % tf
100
IC = 2 mA, VCC = 5 V, CTR = 200 %
1 000
Switching Time t (s)
Switching Time t ( s)
100
10
ts tr td
tf tr
10
td
1
1
ts
0.1 10
100
1k
10 k
0.1 100
1k
10 k
100 k
Load Resistance RL (k)
Load Resistance RL (k)
FREQUENCY RESPONSE
LONG TERM CTR DEGRADATION
IF = 1 mA
1.2 1.0
0 -5 RL = 1 k -10 -15 -20 -25 0.1 300
CTR (Relative Value)
Normalized Gain Gv
100
0.8 TA = 25 C 0.6 0.4 0.2 0 10 TA = 60 C
1
10 Frequency f (kHz)
100
1 000
102
103
104
105
106
Time (Hr)
Remark The graphs indicate nominal characteristics.
6
Data Sheet P14945EJ1V0DS00
PS2711-1
TAPING SPECIFICATIONS (in millimeters)
Outline and Dimensions (Tape)
2.00.1 4.00.1 1.750.1
1.550.1
2.40.1 12.00.2
5.50.1
1.550.1 8.00.1
4.60.1
0.3
Tape Direction
PS2711-1-F3
PS2711-1-F4
Outline and Dimensions (Reel)
1.5
120
21.00.8
7.40.1
1.50.5
60
6.01
330
2.00.5
13.00.5
805.0
12.4+2.0 -0.0
Packing: 3 500 pcs/reel
Data Sheet P14945EJ1V0DS00
7
PS2711-1
NOTES ON HANDLING 1. Recommended soldering conditions
(1) Infrared reflow soldering * Peak reflow temperature * Time of temperature higher than 210 C * Number of reflows * Flux 235 C or below (package surface temperature) 30 seconds or less Three Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt % is recommended.)
Recommended Temperature Profile of Infrared Reflow
Package Surface Temperature T (C)
(heating) to 10 s 235 C (peak temperature) 210 C to 30 s 100 to 160 C 60 to 120 s (preheating)
Time (s)
(2) Dip soldering * Temperature * Time * Number of times * Flux 260 C or below (molten solder temperature) 10 seconds or less One (Allowed to be dipped in solder including plastic mold portion.) Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt % is recommended.) (3) Cautions * Fluxes Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent.
2. Cautions regarding noise
Be aware that when voltage is applied suddenly between the photocoupler's input and output or between corrector-emitters at startup, the output side may enter the on state, even if the voltage is within the absolute maximum ratings.
8
Data Sheet P14945EJ1V0DS00
PS2711-1
[MEMO]
Data Sheet P14945EJ1V0DS00
9
PS2711-1
[MEMO]
10
Data Sheet P14945EJ1V0DS00
PS2711-1
[MEMO]
Data Sheet P14945EJ1V0DS00
11
PS2711-1
CAUTION
Within this device there exists GaAs (Gallium Arsenide) material which is a harmful substance if ingested. Please do not under any circumstances break the hermetic seal.
NEPOC is a trademark of NEC Corporation.
* The information in this document is current as of July, 2000. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products and/or types are available in every country. Please check with an NEC sales representative for availability and additional information. * No part of this document may be copied or reproduced in any form or by any means without prior written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document. * NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC semiconductor products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC or others. * Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of customer's equipment shall be done under the full responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. * While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC semiconductor products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment, and anti-failure features. * NEC semiconductor products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products developed based on a customer-designated "quality assurance program" for a specific application. The recommended applications of a semiconductor product depend on its quality grade, as indicated below. Customers must check the quality grade of each semiconductor product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness to support a given application. (Note) (1) "NEC" as used in this statement means NEC Corporation and also includes its majority-owned subsidiaries. (2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for NEC (as defined above).
M8E 00. 4

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